Amaoe BGA Reballing Stencil FOR Qualcomm Audio WIFI IC WCD9330 WCD9341 WCD9340 WCD9335 WCN3660 WCN3680 Chip BGA IC Reballing Tin
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Price increased by 0.88 $
Higher than average, a lotReliable seller: 89%
Above average, safe to buy, Heimer Repair Store
- More than 4 years of seller experience
- High general feedback score (1118)
- Customers are satisfied by communication
- Items match description
- High shipping speed
- 4.4% of customers were dissatisfied over the last 3 months
Prices at other sellers from 4.32 $
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4.32 $
Amaoe high quality bga reballing stencil for qualcomm msm8974 cpu up&down
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Product specifications
- Тип: Другие
- Индивидуальное изготовление: Нет
- Материал: Нержавеющая сталь
- Применение: Коммерческое производство
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