Amaoe BGA Reballing Stencil FOR Qualcomm PM660 670 845 MT6358W 6356W 6355W 6357V 6370P Power PMIC Chip BGA IC Reballing Tin
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Lower than average, a bitReliable seller: 89%
Above average, safe to buy, Heimer Repair Store
- More than 4 years of seller experience
- High general feedback score (1118)
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- 4.4% of customers were dissatisfied over the last 3 months
Prices at other sellers from 5.17 $
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4.32 $
Amaoe high quality bga reballing stencil for qualcomm msm8974 cpu up&down
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Seller reliability 72%
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Product specifications
- Type: Other
- is_customized: No
- Material: Stainless steel
- Usage: Commercial Manufacture
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