Wylie BGA Reballing Stencil for Huawei samsung CPU RAM IC Chip MSM8998 MSM8996 MSM8992 MSM8956 MSM8976
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Price increased by 0.26 $
Higher than average, a bitReliable seller: 89%
Above average, safe to buy, Phonenix Store
- More than 4 years of seller experience
- High general feedback score (7320)
- Customers are satisfied by communication
- Items match description
- High shipping speed
- 3.3% of customers were dissatisfied over the last 3 months
Prices at other sellers from 6.7 $
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4.32 $
High quality bga reballing stencil for msm8998 cpu up&down board stencil
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Seller reliability 72%
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Product specifications
- Type: Other
- is_customized: No
- Material: Stainless steel
- Usage: Commercial Manufacture
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